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1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB

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1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB

Brand Name : Bicheng

Model Number : BIC-470.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : FR-4

Layer count : 2 layers

PCB thickness : 1.0mm ±0.1

PCB size : 120 x 79mm=4PCS

Solder mask : Green

Silkscreen : White

Copper weight : 1oz

Surface finish : Immersion Silver

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Immersion Silver PCB On 1.0mm Epoxy Glass ITEQ FR-4 2 Layer Circuit Board for USB Charger
1.1 General description
This is a type of 2 layer printed circuit board built on FR-4 substrate with Tg 170°C for the application of USB charger. It's 1.0 mm thick with white silkscreen(Taiyo) on green solder mask (Nanya) and immersion silver on pads. The base material is from Taiwan ITEQ supplying 4 up PCB per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 30 panels are packed for shipment.
1.2 Features and benifits
Outstanding thermal resistance and suitable for lead-free process
Can be horizontal operation and has high efficiency
AOI inspection
Meeting your PCB needs from prototype to mass production.
12 hours quotation
Prototype PCB capability
1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB
1.3 Application
Router Wireless
Bluetooth Adapter For PC
Motor Controller
GSM Tracking
Modem HSDPA
1.4 Parameter and data sheet
PCB SIZE 120 x 79mm=4PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layes
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 17.8um(0.5oz)+PLATE
FR-4 0.8mm
copper ------- 17.8um(0.5oz)+PLATE
TECHNOLOGY
Minimum Trace and Space: 4mil/4mil
Minimum / Maximum Holes: 0.5/3.8mm
Number of Different Holes: 4
Number of Drill Holes: 135
Number of Milled Slots: 1
Number of Internal Cutouts: 0
Impedance Control no
BOARD MATERIAL
Glass Epoxy: FR-4, ITEQ IT-180A TG>170
Final foil external: 1oz
Final foil internal: 0oz
Final height of PCB: 1.0mm ±0.1
PLATING AND COATING
Surface Finish Immersion Silver, Ag>0.15µm
Solder Mask Apply To: Top and Bottom, 12micon Minimum.
Solder Mask Color: Green, LP-4G G-05, Nanya supplied
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP
Colour of Component Legend White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated Through Hole(PTH), via tented.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.
1.0mm Epoxy Glass ITEQ FR4 2 Layer Circuit Board Immersion Silver PCB
1.5 ITEQ Laminate/ Prepreg : IT-180ATC / IT-180ABS
Property Thickness<0.50 mm Thickness≧0.50 mm Units Test Method
[0.0197 in] [0.0197 in]
Typical Value Spec Typical Value Spec Metric IPC-TM-650
(English) (or as noted)
Peel Strength, minimum N/mm 2.4.8
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil] (lb/inch) 2.4.8.2
B. Standard profile copper foil 0.88 (5.0) 0.70 (4.00) 0.88 (5.0) 0.70 (4.00) 2.4.8.3
1. After Thermal Stress
2. At 125°C [257 F]
3. After Process Solutions 1.23 (7.0) 0.80 (4.57) 1.40 (8.0) 1.05 (6.00)
1.05 (6.0) 0.70 (4.00) 1.23 (7.0) 0.70 (4.00)
1.05 (6.0) 0.55 (3.14) 1.23 (7.0) 0.80 (4.57)
Volume Resistivity, minimum MW-cm 2.5.17.1
A. C-96/35/90 3.0x1010 106 -- --
B. After moisture resistance -- -- 3.0x1010 104
C. At elevated temperature E-24/125 5.0x1010 103 1.0x1010 103
Surface Resistivity, minimum MW 2.5.17.1
A. C-96/35/90 3.0x1010 104 -- --
B. After moisture resistance -- -- 3.0x1010 104
C. At elevated temperature E-24/125 4.0x1010 103 4.0x1010 103
Moisture Absorption, maximum -- -- 0.12 0.8 % 2.6.2.1
Dielectric Breakdown, minimum -- -- 60 40 kV 2.5.6
Permittivity (Dk, 50% resin content) 5.4 5.4 --
(Laminate & Laminated Prepreg)
A. 1MHz 4.4 4.4 2.5.5.9
B. 1GHz 4.4 4.4
C. 2GHz 4.2 4.3 2.5.5.13
D. 5GHz 4.1 4.1
E. 10GHz 4 4.1
Loss Tangent (Df, 50% resin content) 0.035 0.035 --
(Laminate & Laminated Prepreg)
A. 1MHz 0.015 0.014 2.5.5.9
B. 1GHz 0.015 0.015
C. 2GHz 0.015 0.015 2.5.5.13
D. 5GHz 0.016 0.016
E. 10GHz 0.017 0.016
Flexural Strength, minimum N/mm2 2.4.4
A. Length direction -- -- 500-530 415 (lb/in2)
-- -- (72,500-76,850) -60,190
B. Cross direction -- -- 410-440 345
-- -- (59,450-63,800) -50,140
Arc Resistance, minimum 125 60 125 60 s 2.5.1
Thermal Stress 10 s at 288°C [550.4F],minimum Rating 2.4.13.1
A. Unetched Pass Pass Visual Pass Pass Visual
B. Etched Pass Pass Visual Pass Pass Visual
Electric Strength, minimum 45 30 -- -- kV/mm 2.5.6.2
(Laminate & Laminated Prepreg)
Flammability, V-0 V-0 V-0 V-0 Rating UL94
(Laminate & Laminated Prepreg)
Glass Transition Temperature(DSC) 175 170 minimum 175 170 minimum ˚C 2.4.25
Decomposition Temperature -- -- 345 340 minimum ˚C 2.4.24.6
(5% wt loss)
X/Y Axis CTE (40℃ to 125℃) -- -- 10--13 -- PPM/˚C 2.4.24
Z-Axis CTE 2.4.24
A. Alpha 1 -- -- 45 60 maximum PPM/˚C
B. Alpha 2 -- -- 210 300 maximum PPM/˚C
C. 50 to 260 Degrees C -- -- 2.7 3.0 maximum %
Thermal Resistance 2.4.24.1
A. T260 -- -- >60 30 minimum Minutes
B. T288 -- -- >30 15 minimum Minutes
CAF Resistance -- -- Pass AABUS Pass/Fail 2.6.25


Product Tags:

1.0mm 2 Layer Circuit Board

      

ITEQ FR4 2 Layer Circuit Board

      

ITEQ FR4 Immersion Silver PCB

      
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